Fuji IGBT Modules Application Manual

The Fuji IGBT Modules Application Manual provides comprehensive guidance on the proper selection, installation, operation, and maintenance of Fuji Electric's Insulated Gate Bipolar Transistor modules. These high-performance power semiconductor devices are widely used in industrial applications including motor drives, power supplies, renewable energy systems, and industrial automation. Below are key sections covering specifications, installation procedures, thermal management, protection circuits, and troubleshooting guidelines.

1. Product Overview 2. Electrical Specifications 3. Mechanical Installation 4. Thermal Management 5. Gate Drive Requirements 6. Protection Circuits 7. Application Circuits 8. Maintenance & Inspection 9. Safety Precautions 10. Regulatory Compliance 11. Troubleshooting Guide

Product Overview

Fuji IGBT modules feature advanced trench gate field-stop technology for high efficiency and reliability in power conversion applications.

Feature	Description
Voltage Rating	600V to 1700V series available
Current Rating	10A to 2400A depending on module type
Package Types	Standard, 6-pack, 7-pack, dual, transfer mold
Isolation Voltage	2500V AC for 1 minute
Operating Temperature	-40°C to +150°C (Tj max)
Switching Frequency	Up to 50kHz depending on series
Gate Voltage	±20V maximum, ±15V recommended
Collector-Emitter Saturation	Low VCE(sat) for reduced conduction losses
Short Circuit Withstand	10μs typical at rated conditions
Reverse Bias SOA	Wide RBSOA for robust operation

Electrical Specifications

Detailed electrical characteristics and maximum ratings for proper device selection and application design.

Absolute Maximum Ratings: Collector-Emitter voltage, Gate-Emitter voltage, Collector current.
Thermal Characteristics: Junction-to-case thermal resistance, storage temperature range.
Electrical Characteristics: Collector-Emitter saturation voltage, gate threshold voltage, switching times.
Safe Operating Area: Forward bias SOA, reverse bias SOA, short circuit capability.

WARNING! Exceeding maximum ratings may cause permanent device damage. Always operate within specified limits.

Mechanical Installation

Proper mounting procedures ensure optimal thermal performance and mechanical reliability.

Surface Preparation: Clean heatsink surface to Ra ≤ 10μm, ensure flatness within 50μm.
Thermal Interface: Apply appropriate thermal grease (0.2mm thickness recommended).
Mounting Torque: Apply specified torque (typically 1.2-2.0 N·m) in cross pattern.
Electrical Connections: Use proper busbar design, maintain creepage distances.

CAUTION! Avoid mechanical stress on terminals. Use proper tools for mounting.

Thermal Management

Heatsink Selection: Based on power dissipation and thermal resistance requirements.
Thermal Grease: Silicon-based or ceramic thermal compound recommended.
Temperature Monitoring: Use NTC thermistor for junction temperature estimation.
Cooling Methods: Natural convection, forced air, liquid cooling systems.
Thermal Cycling: Consider power cycling and temperature cycling effects.
Derating Curves: Follow current derating with case temperature.
Mounting Pressure: Maintain 0.5-1.5 MPa interface pressure.
Thermal Impedance: Consider transient thermal impedance for short pulses.

Gate Drive Requirements

Proper gate drive design is critical for optimal switching performance and reliability.

Gate Voltage: +15V/-8V typical for turn-on/turn-off. Gate Resistance: Controls switching speed and EMI. Isolation: Reinforced isolation required for high-side drives. Layout: Minimize parasitic inductance in gate loop. Protection: Implement DESAT detection, soft turn-off, Miller clamp. Power Supply: Low-inductance decoupling capacitors near module.

Protection Circuits

Essential protection features to prevent device failure under abnormal conditions.

Overcurrent Protection: DESAT detection, current sensors, fuses.
Overvoltage Protection: Snubber circuits, clamping devices, varistors.
Overtemperature Protection: NTC monitoring, thermal shutdown.
Short Circuit Protection: Desaturation detection, gate voltage monitoring.

Tip: Implement redundant protection schemes for critical applications.

Application Circuits

Typical circuit configurations for various power conversion topologies.

Three-phase Inverter: Standard 6-pack module configuration for motor drives.
Boost Converter: IGBT with anti-parallel diode for PFC applications.
Half-bridge Configuration: Dual modules for resonant converters.
Chopper Circuits: Single switch applications for DC-DC conversion.
Matrix Converters: Bidirectional switch configurations.
Multi-level Inverters: Series connection for high voltage applications.
Soft-switching Circuits: Resonant topologies for reduced switching losses.
Parallel Operation: Current sharing techniques for high power applications.

WARNING! Follow proper snubber circuit design to limit voltage overshoot.

Maintenance & Inspection

Regular maintenance procedures to ensure long-term reliability and performance.

Safety Precautions

High voltage safety procedures for installation, testing, and maintenance operations.

CAUTION! High voltage present even after power removal. Wait 5 minutes and verify discharge before handling.

Regulatory Compliance

Fuji IGBT modules comply with international standards including UL, CE, and RoHS directives. All products meet IEC 60747 semiconductor standards and are manufactured under ISO 9001 quality systems. For technical support and certification documents, visit www.fujielectric.com or contact your local Fuji Electric representative.

Troubleshooting Guide

Symptom	Possible Cause	Corrective Action
Module failure	Overcurrent, overvoltage, overtemperature	Check protection circuits, verify derating, inspect cooling system.
High switching losses	Inadequate gate drive, high parasitic inductance	Optimize gate resistance, improve PCB layout, verify gate voltage.
Voltage overshoot	High di/dt, inadequate snubber	Increase gate resistance, add snubber circuit, reduce busbar inductance.
Thermal shutdown	Insufficient cooling, overload	Check heatsink, verify airflow, reduce load current.
Gate damage	ESD, overvoltage, oscillation	Implement ESD protection, add gate clamp, use twisted pair wiring.

Testing: Use curve tracer for basic functionality check. Replacement: Always replace with identical part number.

Technical Support: Contact Fuji Electric technical service at +81-3-5435-7200 or www.fujielectric.com