Fuji Electric IGBT Modules Application Manual

The Fuji Electric IGBT Modules Application Manual provides comprehensive guidance for the proper selection, installation, operation, and maintenance of Fuji Electric's Insulated Gate Bipolar Transistor (IGBT) power modules. These high-performance modules are designed for various industrial applications including motor drives, power supplies, renewable energy systems, and industrial automation. Below are key sections covering specifications, installation procedures, thermal management, protection circuits, and troubleshooting guidelines.

1. Features and Benefits 2. Module Selection Guide 3. Installation Procedures 4. Electrical Specifications 5. Thermal Management 6. Gate Drive Requirements 7. Protection Circuits 8. Mounting and Interconnection 9. Maintenance and Inspection 10. Safety Precautions 11. Troubleshooting Guide

Features and Benefits

Fuji Electric IGBT modules offer advanced power semiconductor technology with optimized performance characteristics for industrial applications.

Feature	Description
Low saturation voltage	Reduces conduction losses and improves efficiency
Fast switching speed	Enables higher frequency operation and reduced size
High current capability	Suitable for high-power applications up to several hundred amps
Built-in temperature sensor	Provides thermal protection and monitoring capability
Isolated base plate	Simplifies heatsink mounting and improves insulation
Low thermal resistance	Enhances heat dissipation and reliability
Short-circuit withstand capability	Provides robust operation under fault conditions
RoHS compliant	Meets environmental regulations
Various package options	Available in different sizes and configurations
Long service life	Designed for reliable long-term operation

Module Selection Guide

Proper module selection is critical for optimal performance and reliability in your application.

Determine voltage rating: Select based on DC bus voltage with appropriate margin (typically 2x operating voltage).
Calculate current requirements: Consider peak and RMS current with derating factors.
Evaluate switching frequency: Higher frequencies require modules with lower switching losses.
Consider thermal requirements: Ensure adequate cooling capacity for expected power dissipation.
Check package compatibility: Verify mechanical dimensions and terminal configurations.

IMPORTANT! Always derate current and voltage specifications for reliable operation and extended service life.

Installation Procedures

Follow proper installation procedures to ensure reliable operation and prevent damage to the IGBT modules.

Prepare mounting surface: Ensure flatness and proper surface finish for thermal interface.
Apply thermal compound: Use appropriate thermal interface material with proper thickness.
Mount module: Apply correct torque sequence and values to mounting screws.
Connect power terminals: Use proper busbars or cables with adequate cross-section.
Connect gate drive: Route gate wires away from power circuits to minimize noise.
Verify insulation: Check isolation resistance before applying power.

WARNING! Handle modules with ESD protection. Avoid mechanical stress on terminals and case.

Electrical Specifications

Voltage Ratings: 600V, 1200V, 1700V, 3300V series available
Current Ratings: From 10A to 2400A depending on module type
Collector-Emitter Saturation Voltage: Typically 1.8V to 3.5V at rated current
Gate-Emitter Threshold Voltage: 4.0V to 6.0V standard
Maximum Gate-Emitter Voltage: ±20V absolute maximum
Switching Speed: Turn-on time 0.1-0.5μs, turn-off time 0.2-1.0μs
Isolation Voltage: 2500V AC to 6000V AC depending on series
Operating Temperature: -40°C to +150°C (junction temperature)

Thermal Management

Proper thermal management is essential for reliable operation and long service life of IGBT modules.

Heatsink Selection: Calculate required thermal resistance based on power dissipation and ambient temperature. Consider forced air or liquid cooling for high-power applications.

Thermal Interface: Use high-quality thermal grease or pads with appropriate thickness and thermal conductivity. Mounting Pressure: Apply specified torque in criss-cross pattern to ensure even pressure distribution. Temperature Monitoring: Utilize built-in NTC thermistor for temperature protection and derating.

Gate Drive Requirements

Proper gate drive design is critical for optimal switching performance and reliability.

Gate voltage: Typically +15V for turn-on and 0V/-5V to -15V for turn-off.
Gate resistance: Select based on switching speed requirements and EMI considerations.
Isolation: Provide adequate isolation between control and power circuits.
Protection: Implement DESAT protection, short-circuit detection, and soft turn-off.

Tip: Keep gate drive loops short and use twisted pair wiring to minimize parasitic inductance.

Protection Circuits

Implement comprehensive protection circuits to ensure safe operation under abnormal conditions.

Overcurrent protection: Use DESAT detection or current sensors with appropriate response time.
Overvoltage protection: Implement snubber circuits and active clamping where necessary.
Overtemperature protection: Utilize NTC thermistor with temperature monitoring circuit.
Undervoltage lockout: Prevent operation with insufficient gate voltage.
Short-circuit protection: Design for fast detection and shutdown within specified time.
dv/dt protection: Use gate resistors and snubbers to control voltage transients.

WARNING! Protection circuits must be tested under actual operating conditions to ensure proper functionality.

Mounting and Interconnection

Proper mechanical mounting and electrical interconnection are essential for reliable operation.

Maintenance and Inspection

Regular maintenance and inspection help prevent unexpected failures and extend module life.

Visual Inspection: Check for discoloration, cracks, or damage to case and terminals. Thermal Inspection: Monitor operating temperatures and compare with historical data. Electrical Testing: Periodically measure insulation resistance and check for proper gate function. Connection Check: Verify tightness of electrical connections and mounting hardware.

CAUTION! Always disconnect power and wait for capacitors to discharge before performing maintenance.

Safety Precautions

Fuji Electric IGBT modules operate at high voltages and currents requiring strict safety measures. Follow all local electrical codes and regulations. Use appropriate personal protective equipment when working with powered equipment. Ensure proper grounding and isolation between circuits. Implement emergency stop circuits and safety interlocks. Provide adequate ventilation and fire protection measures.

Troubleshooting Guide

Symptom	Possible Cause	Corrective Action
Module failure	Overcurrent, overvoltage, overtemperature	Check protection circuits; verify proper heatsinking; inspect for short circuits.
Excessive heating	Insufficient cooling, high switching frequency	Improve heatsink performance; reduce switching losses; check thermal interface.
Gate drive issues	Insufficient gate voltage, damaged gate driver	Verify gate voltage levels; check gate resistor values; inspect gate driver circuit.
Switching oscillations	High parasitic inductance, improper gate resistance	Reduce loop inductance; optimize gate resistor values; use gate driver with active clamping.
Isolation failure	Contamination, mechanical damage	Clean module surface; check for physical damage; verify proper mounting torque.

Technical Support: Contact Fuji Electric technical support for application assistance and failure analysis.

Documentation: Refer to specific module datasheets and application notes for detailed information.